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PACKAGE Datasheet, PDF

P-tec Corporation(550)Pan Jit International Inc.(8)Panasonic Battery Group(8)Panasonic Semiconductor(27)PANDUIT CORP.(1)Pasternack Enterprises, Inc.(74)PCA ELECTRONICS INC.(8)Peregrine Semiconductor(2)Peregrine Semiconductor Corp.(1)Pericom Semiconductor Corporation(13)PETERMANN-TECHNIK(14)PhaseLink Corporation(1)PHOENIX CONTACT(10)Pletronics, Inc.(1)Polyfet RF Devices(1)Power-One(8)Premier Magnetics, Inc.(9)Protek Devices(9)Pulse A Technitrol Company(5)Purdy Electronics Corporation(25)Qorvo, Inc(2)QT Optoelectronics(1)Quantum Research Group(1)QUARTZCOM the communications company(14)Quectel Wireless Solutions Co., Ltd.(2)Quelighting Corp(8)Raltron Electronics Corporation(6)RCD COMPONENTS INC.(1)Recom International Power(25)Rectron Semiconductor(11)Renesas Technology Corp(20)RF Micro Devices(2)RF Monolithics, Inc(26)RFHIC(9)Rhombus Industries Inc.(20)Richtek Technology Corporation(15)RICOH electronics devices division(3)Rochester Electronics(4)Rohm(65)Roithner LaserTechnik GmbH(28)RSG Electronic Components GmbH(7)Sames(1)Samsung semiconductor(5)Sangdest Microelectronic (Nanjing) Co., Ltd(7)Sanken electric(9)SanRex Corporation(6)Sanyo Semicon Device(9)SCHOTT CORPORATION(5)Seiko Instruments Inc(26)Seme LAB(528)Semtech Corporation(2)SEMTECH ELECTRONICS LTD.(1)Sensitron(3)Sensortechnics GmbH(3)Seoul Semiconductor(44)SGX Sensortech(2)Shanghai awinic technology co.,ltd(3)SHANGHAI BELLING CO., LTD.(1)Shanghai Leiditech Electronic Technology Co., Ltd(35)Shanghai Semitech Semiconductor Co., Ltd(12)Shanghai Shunye Electronics Co.,Ltd.(1)SHANTOU HUASHAN ELECTRONIC DEVICES CO.,LTD(28)Sharp Corporation(104)SHENZHEN FUMAN ELECTRONICS CO., LTD.(1)Shenzhen Huazhimei Semiconductor Co., Ltd(4)Shenzhen Luguang Electronic Technology Co., Ltd(8)SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.(3)SHENZHEN YONGERJIA INDUSTRY CO.,LTD(1)SHIKUES Electronics(14)Shindengen Electric Mfg.Co.Ltd(41)Shoulder Electronics Limited.(2)Siemens Semiconductor Group(49)Silan Microelectronics Joint-stock(4)Silicon Laboratories(3)Silonex Inc.(8)Sirectifier Global Corp.(1)SIRENZA MICRODEVICES(4)Skyworks Solutions Inc.(16)SMSC Corporation(8)Solid State Optronic(53)Solid States Devices, Inc(12)Solitron Devices Inc.(1)SPANSION(19)Stanford Microdevices(1)STANLEY ELECTRIC CO.,LTD.(14)Stanson Technology(8)StarHope(1)STATEK CORPORATION(1)STATS ChipPAC, Ltd.(1)STMicroelectronics(664)SunLED Corporation(295)Surge Components(3)Suzhou HangJing Electronic Technology Co., LTD(47)SynQor Worldwide Headquarters(3)TAI-SAW TECHNOLOGY CO., LTD.(2)TAITRON Components Incorporated(8)Taiwan Semiconductor Company, Ltd(4)Tak Cheong Electronics (Holdings) Co.,Ltd(47)TE Connectivity Ltd(5)Teccor Electronics(1)TelCom Semiconductor, Inc(1)Teledyne Technologies Incorporated(4)TEMEX(4)TEMIC Semiconductors(3)Texas Instruments(276)Texas Instruments(304)THine Electronics, Inc.(5)Thinki Semiconductor Co., Ltd.(35)Torex Semiconductor(7)Toshiba Semiconductor(21)Total Power International(37)Transcom, Inc.(2)Transko Electronics, Inc.(10)TRANSYS Electronics Limited(1)TriQuint Semiconductor(12)TT Electronics.(34)TXC Corporation.(10)Tyco Electronics(19)
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Searched Keyword : 'PACKAGE' - Total: 295 (1/15) Pages
ManufacturerPart #DatasheetDescription
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SunLED Corporation
XZFMDK07C Datasheet pdf image
266Kb/4P
Robust package
XDVG14C2 Datasheet pdf image
227Kb/3P
Robust package
XZFBBA05C Datasheet pdf image
291Kb/4P
Robust package
XZFMDK14A Datasheet pdf image
250Kb/4P
Robust package
XZMYKVG55W-4 Datasheet pdf image
264Kb/4P
Long life and robust package
XZMDKVG45WT Datasheet pdf image
273Kb/4P
Long life and robust package
XZBGR68W5MAV-3 Datasheet pdf image
235Kb/4P
Long life and robust package
XZCBD67S Datasheet pdf image
280Kb/5P
Long life and robust package
XZDGK50W-2 Datasheet pdf image
285Kb/4P
Long life and robust package
XZDGK55W-1 Datasheet pdf image
244Kb/4P
Long life and robust package
XZDGK55W-2 Datasheet pdf image
279Kb/4P
Long life and robust package
XZFBB67S Datasheet pdf image
278Kb/5P
Long life and robust package
XZFBB74W Datasheet pdf image
267Kb/4P
Long life and robust package
XZM2MR55W-3 Datasheet pdf image
254Kb/4P
Long life and robust package
XZM2MRTNI59W-1 Datasheet pdf image
289Kb/4P
Long life and robust package
XZMDK87W Datasheet pdf image
259Kb/4P
Long life and robust package
XZMOK55W-2 Datasheet pdf image
245Kb/4P
Long life and robust package
XZMOK87W Datasheet pdf image
259Kb/4P
Long life and robust package
XZMDKDGK54W-4 Datasheet pdf image
293Kb/4P
Long life and robust package
XZVG74W Datasheet pdf image
235Kb/4P
Long life and robust package

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What is PACKAGE


In electronic parts, PACKAGE means a case or package used to protect and connect devices.

PACKAGE plays an important role in protecting and connecting devices.

If the device is not properly protected, environmental influences can damage or destroy the device.

PACKAGE comes in various shapes and sizes, and there are various types depending on the type and purpose of the device.

Representative packages include DIP (Dual in-line package), SOP (Small-outline package), QFP (Quad flat package), and BGA (Ball grid array).

A DIP is one of the more representative packages and has two pins placed in-line.

SOPs are smaller packages than DIPs and have a rectangular shape.

QFP is a package with pins parallel to the circumference of the package, and BGA is a package in which small holes are drilled in the bottom of the elements and small beads are attached to them to connect the elements.

Depending on the characteristics of each package, it is used for various purposes.

For example, DIPs are generally used for low-density integrated circuits, and BGAs are used for high-density integrated circuits.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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