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PACKAGE Datasheet, PDF

Searched Keyword : 'PACKAGE' - Total: 44 (1/3) Pages
ManufacturerPart #DatasheetDescription
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Zentrum Mikroelektronik...
MDS735 Datasheet pdf image
127Kb/1P
Package PDIP28
MDS748 Datasheet pdf image
154Kb/1P
Package SOP14
MDS745 Datasheet pdf image
136Kb/1P
Package SOP32
MDS753 Datasheet pdf image
155Kb/1P
Package SSOP16
MDS746 Datasheet pdf image
128Kb/1P
Package PDIP32
MDS717 Datasheet pdf image
156Kb/1P
Package PQFP80
MDS722 Datasheet pdf image
151Kb/1P
Package PQFP144
MDS756 Datasheet pdf image
154Kb/1P
Package SSOP16
MDS724 Datasheet pdf image
148Kb/1P
Package PLCC84
MDS752 Datasheet pdf image
155Kb/1P
Package SOP16
MDS761 Datasheet pdf image
27Kb/1P
Package SSOP14
MDS738 Datasheet pdf image
149Kb/1P
Package LQFP32
MDS712 Datasheet pdf image
128Kb/1P
Package PDIP24
MDS772 Datasheet pdf image
76Kb/1P
Package PLCC32
MDS757 Datasheet pdf image
128Kb/1P
Package SSOP20
MDS731 Datasheet pdf image
146Kb/1P
Package PLCC28
MDS720 Datasheet pdf image
149Kb/1P
Package PQFP52
MDS755 Datasheet pdf image
53Kb/1P
Package PQFP64
MDS726 Datasheet pdf image
49Kb/1P
Package SOP8
MDS749 Datasheet pdf image
148Kb/1P
Package SOP18

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What is PACKAGE


In electronic parts, PACKAGE means a case or package used to protect and connect devices.

PACKAGE plays an important role in protecting and connecting devices.

If the device is not properly protected, environmental influences can damage or destroy the device.

PACKAGE comes in various shapes and sizes, and there are various types depending on the type and purpose of the device.

Representative packages include DIP (Dual in-line package), SOP (Small-outline package), QFP (Quad flat package), and BGA (Ball grid array).

A DIP is one of the more representative packages and has two pins placed in-line.

SOPs are smaller packages than DIPs and have a rectangular shape.

QFP is a package with pins parallel to the circumference of the package, and BGA is a package in which small holes are drilled in the bottom of the elements and small beads are attached to them to connect the elements.

Depending on the characteristics of each package, it is used for various purposes.

For example, DIPs are generally used for low-density integrated circuits, and BGAs are used for high-density integrated circuits.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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