PACKAGE Datasheet(PDF) - ACPL-M62L - AVAGO TECHNOLOGIES LIMITED

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PACKAGE Datasheet, PDF

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Searched Keyword : 'PACKAGE' - Total: 127 (1/7) Pages

Manufacturer	Part #	Datasheet	Description
AVAGO TECHNOLOGIES LIMI...	ACPL-M62L	204Kb/9P	SO-5 package
	MSA-0286	68Kb/4P	Surface Mount Plastic Package
	MSA-0420	154Kb/4P	Hermetic Metal/Beryllia Microstrip Package
	HSMP-381Z	168Kb/5P	2 Leads Surface Mount Package
	HLMP-6305-L0021	240Kb/16P	Subminiature fl at top package
	MSA-0236	375Kb/4P	Cost Effective Ceramic Microstrip Package
	MSA-0636	394Kb/4P	Cost Effective Ceramic Microstrip Package
	MSA-0736	376Kb/4P	Cost Effective Ceramic Microstrip Package
	MSA-1120	155Kb/4P	Hermetic Metal/Beryllia Microstrip Package
	HLMP-7040	240Kb/16P	Subminiature fl at top package
	MSA-0770	162Kb/4P	Hermetic, Gold-ceramic Microstrip Package
	MSA-0336	382Kb/4P	Cost Effective Ceramic Microstrip Package
	MSA-1110	173Kb/4P	Hermetic Gold-ceramic Microstrip Package
	ADJD-E622-QR999	119Kb/12P	RGB Color Sensor in QFN Package
	ACPL-790A-300E	198Kb/15P	Compact, Auto-Insertable DIP-8 Package
	MSA-0311	170Kb/4P	Low Cost Surface Mount Plastic Package
	ACPL-P480	403Kb/10P	Available in Stretched SO-6 package
	ASDL-5772	194Kb/5P	High Performance Photodiode in Side Look Package
	ASDL-5880	195Kb/5P	High Speed Photodiode in Top View Package
	ASDL-5770	195Kb/5P	High Performance Photodiode in Side Look Package

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What is PACKAGE

In electronic parts, PACKAGE means a case or package used to protect and connect devices.

PACKAGE plays an important role in protecting and connecting devices.

If the device is not properly protected, environmental influences can damage or destroy the device.

PACKAGE comes in various shapes and sizes, and there are various types depending on the type and purpose of the device.

Representative packages include DIP (Dual in-line package), SOP (Small-outline package), QFP (Quad flat package), and BGA (Ball grid array).

A DIP is one of the more representative packages and has two pins placed in-line.

SOPs are smaller packages than DIPs and have a rectangular shape.

QFP is a package with pins parallel to the circumference of the package, and BGA is a package in which small holes are drilled in the bottom of the elements and small beads are attached to them to connect the elements.

Depending on the characteristics of each package, it is used for various purposes.

For example, DIPs are generally used for low-density integrated circuits, and BGAs are used for high-density integrated circuits.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.

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