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PACKAGE Datasheet, PDF

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Searched Keyword : 'PACKAGE' - Total: 14 (1/1) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
STANLEY ELECTRIC CO.,LT...
VFSR1112GS-3CX2A-TR Datasheet pdf image
711Kb/24P
Small-sized, high-brightness package
VFSY1112GS-3CY2D-TR Datasheet pdf image
747Kb/24P
Small-sized, high-brightness package
JSB1117ASE-TR Datasheet pdf image
714Kb/24P
Thinner package, Blue color emitting LED
JSG1117ASE-TR Datasheet pdf image
715Kb/24P
Thinner package, Green color emitting LED
JUA1117AS-TR Datasheet pdf image
734Kb/24P
Thinner package, Orange color emitting LED
JDN1102F-TR Datasheet pdf image
583Kb/22P
Side viewing angle package,Infrared LED
JUR1117AS-TR Datasheet pdf image
733Kb/24P
Thinner package, Red color emitting LED
JUY1117AS-TR Datasheet pdf image
733Kb/24P
Thinner package, Yellow color emitting LED
STW1147ASE-TR Datasheet pdf image
853Kb/25P
Thinner package, White color emitting LED
STW1147ASK-TR Datasheet pdf image
743Kb/24P
Thinner package, White color emitting LED
HCNW125DJTE-TR Datasheet pdf image
900Kb/26P
High reliability, High flux, Low thermal resistance package
HCNY115AJTE-TR Datasheet pdf image
820Kb/26P
High reliability, High flux, Low thermal resistance package
HFZV111AJTE-TR Datasheet pdf image
789Kb/25P
High reliability, High flux, Low thermal resistance package
NEU1103EAE-405-TR Datasheet pdf image
313Kb/12P
High reliability hermetically sealed package to reduce influence of humidity and out gasses

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What is PACKAGE


In electronic parts, PACKAGE means a case or package used to protect and connect devices.

PACKAGE plays an important role in protecting and connecting devices.

If the device is not properly protected, environmental influences can damage or destroy the device.

PACKAGE comes in various shapes and sizes, and there are various types depending on the type and purpose of the device.

Representative packages include DIP (Dual in-line package), SOP (Small-outline package), QFP (Quad flat package), and BGA (Ball grid array).

A DIP is one of the more representative packages and has two pins placed in-line.

SOPs are smaller packages than DIPs and have a rectangular shape.

QFP is a package with pins parallel to the circumference of the package, and BGA is a package in which small holes are drilled in the bottom of the elements and small beads are attached to them to connect the elements.

Depending on the characteristics of each package, it is used for various purposes.

For example, DIPs are generally used for low-density integrated circuits, and BGAs are used for high-density integrated circuits.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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