PACKAGE Datasheet(PDF) - ATF-53189 - Agilent(Hewlett-Packard)

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PACKAGE Datasheet, PDF

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Searched Keyword : 'PACKAGE' - Total: 34 (1/2) Pages

Manufacturer	Part #	Datasheet	Description
Agilent(Hewlett-Packard...	ATF-53189	145Kb/14P	Enhancement Mode Pseudomorphic HEMT in SOT 89 Package
	ATF33143	149Kb/14P	Low Noise Pseudomorphic HEMT in a Surface Mount Plastic Package
	ATF-34143	119Kb/15P	Low Noise Pseudomorphic HEMT in a Surface Mount Plastic Package
	HFBR-5905	282Kb/14P	ATM Multimode Fiber Transceivers in 2 x 5 Package Style
	ATF34143	154Kb/15P	Low Noise Pseudomorphic HEMT in a Surface Mount Plastic Package
	HFBR-5903	291Kb/16P	FDDI, Fast Ethernet Transceivers in 2 x 5 Package Style
	MGA-725M4	188Kb/20P	Low Noise Amplifier with Bypass Switch In Miniature Leadless Package
	ATF-35143	127Kb/19P	Low Noise Pseudomorphic HEMT in a Surface Mount Plastic Package
	ATF35143	195Kb/19P	Low Noise Pseudomorphic HEMT in a Surface Mount Plastic Package
	ATF38143	156Kb/14P	Low Noise Pseudomorphic HEMT in a Surface Mount Plastic Package
	ATF-541M4	169Kb/16P	Low Noise Enhancement Mode Pseudomorphic HEMT in a Miniature Leadless Package
	ATF-531P8	142Kb/16P	High Linearity Enhancement Mode Pseudomorphic HEMT in 2x2 mm LPCC Package
	HFBR-5106	265Kb/15P	100VG-AnyLAN Multimode Fiber Transceivers in Low Cost 1x9 Package Style
	ATF-551M4	198Kb/24P	Low Noise Enhancement Mode Pseudomorphic HEMT in a Miniature Leadless Package
	ATF54143	154Kb/16P	Low Noise Enhancement Mode Pseudomorphic HEMT in a Surface Mount Plastic Package
	ATF331M4	171Kb/17P	Agilent ATF-331M4 Low Noise Pseudomorphic HEMT in a Miniature Leadless Package
	HSDL-44XX	290Kb/19P	High-Performance IR Emitter and IR PIN Photodiode in Subminiature SMT Package
	ATF-58143	149Kb/10P	Low Noise Enhancement Mode Pseudomorphic HEMT in a Surface Mount Plastic Package
	HSDL-3203	238Kb/19P	Small Profile Package IrDA Data Compliant Low Power 115.2 kbit/s Infrared Transceiver
	HDSP-H571	86Kb/7P	5 x 7 General Purpose Dot Matrix Displays 53.2 mm (2.09 Inch) Package

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What is PACKAGE

In electronic parts, PACKAGE means a case or package used to protect and connect devices.

PACKAGE plays an important role in protecting and connecting devices.

If the device is not properly protected, environmental influences can damage or destroy the device.

PACKAGE comes in various shapes and sizes, and there are various types depending on the type and purpose of the device.

Representative packages include DIP (Dual in-line package), SOP (Small-outline package), QFP (Quad flat package), and BGA (Ball grid array).

A DIP is one of the more representative packages and has two pins placed in-line.

SOPs are smaller packages than DIPs and have a rectangular shape.

QFP is a package with pins parallel to the circumference of the package, and BGA is a package in which small holes are drilled in the bottom of the elements and small beads are attached to them to connect the elements.

Depending on the characteristics of each package, it is used for various purposes.

For example, DIPs are generally used for low-density integrated circuits, and BGAs are used for high-density integrated circuits.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.

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