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PACKAGE Datasheet, PDF

Fairchild Semiconductor(57)FCI connector(1)Finisar Corporation.(18)First Components International(4)First Silicon Co., Ltd(6)Fitipower Integrated Technology Inc.(2)Formosa MS(2)Foshan Blue Rocket Electronics Co.,Ltd.(1728)Fox Electronics(2)Freescale Semiconductor, Inc(6)Fuji Electric(132)Fujikura Ltd.(4)Fujitsu Component Limited.(11)Future Technology Devices International Ltd.(1)FutureWafer Tech Co.,Ltd(12)Galaxy Semi-Conductor Holdings Limited(22)Gamma Microelectronics Inc.(2)Gaomi Xinghe Electronics Co., Ltd.(1)GAPTEC Electronic GmbH & Co. KG(28)GeneSiC Semiconductor, Inc.(15)Gilway Technical Lamp(1)Global Mixed-mode Technology Inc(157)Golledge Electronics Ltd(43)Grayhill, Inc(4)Green Power Solutions srl(4)GSI Technology(306)GuangDong Province MengCo Semiconductor Co., Ltd(2)Guangdong Youtai Semiconductor Co., Ltd.(24)Guangzhou Reicu Electronic Technology Co., Ltd(38)HALO Electronics, Inc.(12)Hamamatsu Corporation(43)HB Electronic Components(2)Hi-Sincerity Mocroelectronics(2)Hitachi Semiconductor(1)HITRON ELECTRONICS CORPORTION(12)HK TO-GRACE TECHNOLOGY CO.,LTD.(212)Holt Integrated Circuits(1)Holtek Semiconductor Inc(10)Honeywell Accelerometers(15)Honeywell Solid State Electronics Center(6)HuaXinAn Electronics CO.,LTD(2)HY ELECTRONIC CORP.(2)IDEA.lnc.(10)IK Semicon Co., Ltd(2)ILSI America LLC(81)Inchange Semiconductor Company Limited(40)Infineon Technologies AG(74)Integrated Circuit Solution Inc(1)Integrated Circuit Systems(1)Integrated Device Technology(8)Integrated Silicon Solution, Inc(3)Integrated Technology Future(1)Intel Corporation(5)InterFET Corporation(1)International Rectifier(161)Intersil Corporation(3)Intronics Power, Inc.(1)IQD Frequency Products Ltd(11)IRC - a TT electronics Company.(1)Ironwood Electronics.(2)Isahaya Electronics Corporation(2)ITT Industries(1)IXYS Corporation(38)Japan Aviation Electronics Industry, Ltd.(1)JDS Uniphase Corporation(2)JMK Inc.(2)
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Searched Keyword : 'PACKAGE' - Total: 28 (1/2) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
SHANTOU HUASHAN ELECTRO...
HTF6A60 Datasheet pdf image
203Kb/3P
INSULATED TYPE TRIAC (TO-220F PACKAGE)
HTF8A60 Datasheet pdf image
324Kb/3P
INSULATED TYPE TRIAC (TO-220F PACKAGE)
HTF16A60 Datasheet pdf image
205Kb/3P
INSULATED TYPE TRIAC (TO-220F PACKAGE)
HTM4A60 Datasheet pdf image
176Kb/3P
INSULATED TYPE TRIAC (TO-126ML PACKAGE)
HBT137F-600 Datasheet pdf image
201Kb/3P
INSULATED TYPE TRIAC (TO-220F PACKAGE)
HBT138F-600 Datasheet pdf image
201Kb/3P
INSULATED TYPE TRIAC (TO-220F PACKAGE)
HBT139F-600 Datasheet pdf image
200Kb/3P
INSULATED TYPE TRIAC (TO-220F PACKAGE)
HTF12A60 Datasheet pdf image
203Kb/3P
INSULATED TYPE TRIAC (TO-220F PACKAGE)
HTP16A60 Datasheet pdf image
192Kb/3P
NON INSULATED TYPE TRIAC (TO-220 PACKAGE)
HTP8A60 Datasheet pdf image
214Kb/3P
NON INSULATED TYPE TRIAC (TO-220 PACKAGE)
HTM2A60 Datasheet pdf image
740Kb/3P
NON INSULATED TYPE TRIAC (TO-126ML PACKAGE)
HTN2A60 Datasheet pdf image
180Kb/3P
NON INSULATED TYPE TRIAC (TO-126 PACKAGE)
HTF8A80 Datasheet pdf image
162Kb/3P
NON INSULATED TYPE TRIAC (TO-220F PACKAGE)
HTP6A60 Datasheet pdf image
176Kb/3P
NON INSULATED TYPE TRIAC (TO-220 PACKAGE)
HTP4A60 Datasheet pdf image
176Kb/3P
NON INSULATED TYPE TRIAC (TO-220 PACKAGE)
HTP12A60 Datasheet pdf image
189Kb/3P
NON INSULATED TYPE TRIAC (TO-220 PACKAGE)
HTN4A60 Datasheet pdf image
175Kb/3P
NON INSULATED TYPE TRIAC (TO-126 PACKAGE)
HTP20A60 Datasheet pdf image
179Kb/3P
NON INSULATED TYPE TRIAC (TO-220 PACKAGE)
HBTA6A60 Datasheet pdf image
136Kb/3P
INNER INSULATED TYPE TRIAC (II TO-220 PACKAGE)
HBTA12A60 Datasheet pdf image
148Kb/3P
INNER INSULATED TYPE TRIAC (II TO-220 PACKAGE)

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What is PACKAGE


In electronic parts, PACKAGE means a case or package used to protect and connect devices.

PACKAGE plays an important role in protecting and connecting devices.

If the device is not properly protected, environmental influences can damage or destroy the device.

PACKAGE comes in various shapes and sizes, and there are various types depending on the type and purpose of the device.

Representative packages include DIP (Dual in-line package), SOP (Small-outline package), QFP (Quad flat package), and BGA (Ball grid array).

A DIP is one of the more representative packages and has two pins placed in-line.

SOPs are smaller packages than DIPs and have a rectangular shape.

QFP is a package with pins parallel to the circumference of the package, and BGA is a package in which small holes are drilled in the bottom of the elements and small beads are attached to them to connect the elements.

Depending on the characteristics of each package, it is used for various purposes.

For example, DIPs are generally used for low-density integrated circuits, and BGAs are used for high-density integrated circuits.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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