Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.COM

X  



PACKAGE Datasheet, PDF

Searched Keyword : 'PACKAGE' - Total: 14813 (1/741) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Amkor Technology
PSVFBGA Datasheet pdf image
251Kb/2P
Package on Package (PoP) Family
Company Logo Img
KEC(Korea Electronics)
KDV239 Datasheet pdf image
349Kb/1P
USC PACKAGE
KDV269 Datasheet pdf image
350Kb/1P
USC PACKAGE
KDV269E Datasheet pdf image
49Kb/1P
ESC PACKAGE
KDV269V Datasheet pdf image
14Kb/1P
VSC PACKAGE
KDV273 Datasheet pdf image
349Kb/1P
USC PACKAGE
KDZ11V Datasheet pdf image
21Kb/1P
USC PACKAGE
KDZ110VW Datasheet pdf image
21Kb/1P
USC PACKAGE
KDR105 Datasheet pdf image
21Kb/1P
USM PACKAGE
KDR331 Datasheet pdf image
21Kb/1P
USM PACKAGE
KDS121V Datasheet pdf image
12Kb/1P
VSM PACKAGE
KDS125E Datasheet pdf image
351Kb/1P
TES6 PACKAGE
KRA301 Datasheet pdf image
32Kb/1P
USM PACKAGE
KDV175 Datasheet pdf image
349Kb/1P
USC PACKAGE
KDV214A Datasheet pdf image
349Kb/1P
USC PACKAGE
KDV214V Datasheet pdf image
14Kb/1P
VSC PACKAGE
Company Logo Img
CITIZEN ELECTRONICS CO....
CL-L430-MC1W1-A-T Datasheet pdf image
404Kb/12P
LED package
Company Logo Img
Zentrum Mikroelektronik...
MDS735 Datasheet pdf image
127Kb/1P
Package PDIP28
MDS748 Datasheet pdf image
154Kb/1P
Package SOP14
Company Logo Img
KEC(Korea Electronics)
KDR322 Datasheet pdf image
21Kb/1P
USM PACKAGE

1 2 3 4 5 6 7 8 9 10 > >>


1 2 3 4 5 > >>



What is PACKAGE


In electronic parts, PACKAGE means a case or package used to protect and connect devices.

PACKAGE plays an important role in protecting and connecting devices.

If the device is not properly protected, environmental influences can damage or destroy the device.

PACKAGE comes in various shapes and sizes, and there are various types depending on the type and purpose of the device.

Representative packages include DIP (Dual in-line package), SOP (Small-outline package), QFP (Quad flat package), and BGA (Ball grid array).

A DIP is one of the more representative packages and has two pins placed in-line.

SOPs are smaller packages than DIPs and have a rectangular shape.

QFP is a package with pins parallel to the circumference of the package, and BGA is a package in which small holes are drilled in the bottom of the elements and small beads are attached to them to connect the elements.

Depending on the characteristics of each package, it is used for various purposes.

For example, DIPs are generally used for low-density integrated circuits, and BGAs are used for high-density integrated circuits.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


Link URL :

Privacy Policy
ALLDATASHEET.COM
Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Datasheet Upload   |   Contact us   |   Privacy Policy   |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com