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PLASTIC Datasheet, PDF

ALL 3M Electronics(11)AAEON Technology(1)Aavid, Thermal Division of Boyd Corporation(1)Abracon Corporation(26)ACE Technology Co., LTD.(3)Adam Technologies, Inc.(13)Advanced Crystal Technology(5)Advanced Photonix, Inc.(24)Advanced Technology Electronics CO., LTD(1)Advanced Thermal Solutions, Inc.(6)AEL Crystals Ltd(4)Aeroflex Circuit Technology(2)Agilent(Hewlett-Packard)(13)AiT Semiconductor Inc.(2)Allied Components International(1)Alpha & Omega Semiconductors(47)Alpha Industries(9)Alpha Wire(17)Altech corporation(2)Amkor Technology(1)Amphenol Communications Solutions(1)Amphenol Corporation(6)Analog Technologies, Inc.(2)API Delevan(1)Arch Electronics Corp.(20)Assmann Electronics Inc.(8)ATMEL Corporation(2)AUK corp(1)Austin Semiconductor(21)AVAGO TECHNOLOGIES LIMITED(30)Avic Technology(37)AVX Corporation(1)Axiomtek Co., Ltd.(3)BaiDu Micro electrons Co., Ltd(1)Banner Engineering Corp.(2)Bedford Opto Technology Ltd.(4)Bel Fuse Inc.(3)Bi technologies(26)Boca Semiconductor Corporation(6)Bourns Electronic Solutions(5)BRIGHT LED ELECTRONICS CORP(1)Broadcom Corporation.(12)Bruckewell Technology LTD(7)Bud Industries, Inc.(13)BusBoard Prototype Systems Ltd.(3)Bytesonic Electronics Co., Ltd.(1)C-Media Electronics(1)Caliber Electronics Inc.(3)California Eastern Labs(8)Carlo Gavazzi Holding AG(2)Central Semiconductor Corp(2)Changzhou Shunye Electronics Co.,Ltd.(1)CHENG-YI ELECTRONIC CO., LTD.(13)Chenmko Enterprise Co. Ltd.(5)Cherry Semiconductor Corporation(1)Chongqing Pingwei Enterprise co.,Ltd(45)CITIZEN ELECTRONICS CO., LTD.(1)Comchip Technology(2)Compact Technology Corp.(17)CONEC Elektronische Bauelemente GmbH(53)Continental Device India Limited(158)Copal Electronics(5)Cornell Dubilier Electronics(2)Cree, Inc(1)Crystek Corporation(1)CTS Corporation(5)CUI INC(4)Cystech Electonics Corp.(15)Daya Electric Group Co., Ltd.(59)DB Lectro Inc(1)Delta Electronics, Inc.(4)Digitron Semiconductors(3)Diode Semiconductor Korea(42)Diodes Incorporated(1)DIYI Electronic Technology Co., Ltd.(14)Dongguan City Niuhang Electronics Co.LTD(9)DONGGUAN YOU FENG WEI ELECTRONICS CO., LTD(8)Dubilier(5)E-Tech Electronics LTD(3)Ecliptek Corporation(4)EDAC, All Rights Reserved.(30)EIC discrete Semiconductors(8)EM Microelectronic - MARIN SA(2)Endress+Hauser Group Services AG(1)EPCOS(5)Epson Company(1)ETRI(3)Everlight Electronics Co., Ltd(4)
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Searched Keyword : 'PLASTIC' - Total: 21 (1/2) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
NXP Semiconductors
CAX100 Datasheet pdf image
16Kb/1P
Plastic Collimator Lens
1999-07-13
SOT353 Datasheet pdf image
13Kb/1P
Plastic surface-mounted package; 5 leads
21 March 2006
SOT143B Datasheet pdf image
9Kb/1P
Plastic surface mounted package; 4 leads
29 November 2004
SOT343N Datasheet pdf image
13Kb/1P
Plastic surface mounted package; 4 leads
1999 Apr 16
SOT389-1 Datasheet pdf image
14Kb/1P
Plastic Low Profile Quad flat Package
2002 Jun 07
SOT117-1 Datasheet pdf image
9Kb/1P
DIP28: plastic dual in-line package; 28 leads (600 mil)
2003 Feb 18
SOT108-1 Datasheet pdf image
10Kb/1P
SO14: plastic small outline package; 14 leads; body width 3.9 mm
2003 Mar 24
SOT340-1 Datasheet pdf image
11Kb/1P
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
2003 Mar 24
SOT765-1 Datasheet pdf image
13Kb/1P
plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
2002 Jun 07
PSMN005-75P Datasheet pdf image
271Kb/13P
N-channel logic level field-effect power transistor in a plastic package using TrenchMOS technology.
Rev. 01-26 April 2002
BZB84-C5V1215 Datasheet pdf image
90Kb/14P
General-purpose Zener diodes in a SOT23 (TO-236AB) small Surface-Mounted Device (SMD) plastic package
Rev. 03-9 June 2009
PHB191NQ06LT Datasheet pdf image
91Kb/13P
Logic level N-channel enhancement mode field-effect transistor in a plastic package using TrenchMOS technology
Rev. 01-05 May 2004
SOT926-1 Datasheet pdf image
239Kb/1P
plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
2009
PH1955L Datasheet pdf image
77Kb/12P
Logic level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology.
Rev. 01-15 August 2005
NZH3V0B-115 Datasheet pdf image
112Kb/9P
General-purpose Zener diodes in a SOD123F small and flat lead Surface-Mounted Device (SMD) plastic package
Rev. 01-27 January 2010
NZH5V1B-115 Datasheet pdf image
112Kb/9P
General-purpose Zener diodes in a SOD123F small and flat lead Surface-Mounted Device (SMD) plastic package
Rev. 01-27 January 2010
SOT545-3 Datasheet pdf image
15Kb/1P
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
2004 Feb 05
BFU725FN1-115 Datasheet pdf image
80Kb/11P
NPN silicon germanium microwave transistor for high speed, low noise applications in a plastic, 4-pin dual-emitter SOT343F package
Rev. 01-13 July 2009
BUK7520-55A Datasheet pdf image
318Kb/15P
N-channel enhancement mode field-effect power transistor in a plastic package using TrenchMOS technology, featuring very low on-state resistance.
Rev. 01-18 January 2001
BAT721-215 Datasheet pdf image
82Kb/11P
Planar Schottky barrier diodes with an integrated guard ring for stress protection. Encapsulated in small Surface-Mounted Device (SMD) plastic packages.
Rev. 06-21 December 2006

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What is PLASTIC


In electronic parts, plastic refers to plastic materials used as materials that form the exterior of electronic parts.

In electronic components, plastic is one of the most widely used materials because it is durable, lightweight, and inexpensive to produce.

In electronic components that form the exterior of electronic products, plastics can be produced in a variety of colors and designs.

Electronic parts with a plastic exterior have high strength and durability, and durability is improved when they are made of materials with fire resistance and chemical resistance.

Plastic plays a very important role in increasing the stability and durability of electronic components.

Plastics used in electronic components can be used as safe electrical insulators.

In addition, it can operate stably in high temperature and high pressure, and can be equipped with waterproof and dustproof functions.

The plastic materials most commonly used in electronic components include polycarbonate, acrylic, polyamide, polypropylene, and polyethylene.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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