| Electronic Manufacturer | Part Number | Datasheet | Electronics Description |
Molex Electronics Ltd.
|
10-89-7102 |
 |
2.54mm Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 10 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm PC Tail |
| 10-89-7120 |
|
2.54mm Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 12 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm PC Tail |
| 21020-1028 |
|
0.50mm Pitch Premo-Flex™ FFC Jumper, Opposite Side Contacts (Type D), 31 Circuits, 0.305m Cable Length, 0.27mm Cable Thickness, Tin(Sn) Plating |
| 39-30-0240 |
|
4.20mm Pitch Mini-Fit Jr.™ Header, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 24 Circuits, PA Polyamide Nylon 6/6 94V-0, Tin (Sn) Plating |
| 26-60-5020 |
|
3.96mm Pitch KK® Solid Header, Right Angle, with Friction Lock, 2 Circuits, Tin (Sn) Plating |
| 46018-1541 |
|
Mini-Fit® Plus HMC (High Mating Cycle) Female Crimp Terminal, 18-20 AWG, Reel, Select Gold (Au) Plating with Proprietary Molex Advanced Contact Surface Finish (CSF) in Contact Area |
| 22-28-4061 |
|
2.54mm Pitch KK® Header, Breakaway, Vertical, 6 Circuits, Tin (Sn) Plating, Mating Pin Length 8.13mm |
| 39-29-5063 |
|
4.20mm Pitch Mini-Fit Jr.™ Header, Dual Row, Right Angle, with PCB Mounting Flange, 6 Circuits, PA Polyamide Nylon 6/6 94V-2, .0.76μm Gold (Au) Plating |
| 52437-2472 |
|
0.5 FPC CONN. ZIF FOR SMT R/A (BOTTOM CONTACT) TIN-BISMUTH PLATING |
| 99-99-0988 |
|
2.50mm Pitch SPOX™ Wire-to-Board Header, Vertical, Shrouded, 4 Circuits, Tin (Sn) Plating, with Swaged PC Tails |
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