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PLATING Datasheet, PDF

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Searched Keyword : 'PLATING' - Total: 860 (1/43) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd. 		0740950046 Datasheet pdf image
221Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 16 Circuits0.38關m (15關") Gold (Au) Selective Plating over Tin (Sn) Plating
0740950055 Datasheet pdf image
221Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 25 Circuits0.38關m (15關") Gold (Au) Selective Plating over Tin (Sn) Plating
0740950085 Datasheet pdf image
221Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 25 Circuits0.76關m (30關") Gold (Au) Selective Plating over Tin (Sn) Plating
0740950050 Datasheet pdf image
221Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 20 Circuits0.38關m (15關") Gold (Au) Selective Plating over Tin (Sn) Plating
0740950080 Datasheet pdf image
221Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 20 Circuits,0.76關m (30關") Gold (Au) Selective Plating over Tin (Sn) Plating
0705430113 Datasheet pdf image
429Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 9Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630023 Datasheet pdf image
225Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 24Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430016 Datasheet pdf image
429Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 17Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430127 Datasheet pdf image
429Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 23Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430112 Datasheet pdf image
429Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 8Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630007 Datasheet pdf image
225Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 8Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630012 Datasheet pdf image
225Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 13Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430008 Datasheet pdf image
429Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 9Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430015 Datasheet pdf image
429Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 16Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630003 Datasheet pdf image
225Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 4Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630020 Datasheet pdf image
225Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 21Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630014 Datasheet pdf image
225Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 15Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430110 Datasheet pdf image
429Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 6Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430001 Datasheet pdf image
429Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 2Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630122 Datasheet pdf image
225Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 18Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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What is PLATING

Electronic component plating plays an important role in the manufacturing process of electronic components.

Plating is used to improve the appearance of electronic components or improve their electronic performance.

For example, plating is used to prevent corrosion and improve durability.

Plating is also used to improve electrical resistance and electrical conductivity.

These platings can be applied to connecting pins, pads, cases, and other parts of electronic components.

The types of plating used in electronic components include gold, silver, nickel, and copper.

Among them, gold plating is the most used and widely used because of its excellent corrosion resistance and electrical performance.

The types and application methods of plating for electronic parts vary depending on the purpose of the part, device composition, and usage environment.

Therefore, during electronic component manufacturing, efforts are made to ensure optimum performance and durability by selecting the appropriate plating method.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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