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PLATING Datasheet, PDF

Search Description : 'PLATING' - Total: 6006 (1/301) Pages
Electronic ManufacturerPart NumberDatasheetElectronics Description

Molex Electronics Ltd.
15-80-0563 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-1521 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.76μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15-80-0585 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0403 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
10-89-7140 2.54mm Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 14 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm PC Tail
15-80-0245 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0285 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0363 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0705 null2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-91-2065 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 6 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-91-2075 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 7 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0525 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-91-2095 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 9 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-1401 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15-91-2145 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 14 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0243 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0409 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.38μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15-80-0303 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0283 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0463 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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