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PLATING Datasheet, PDF

ALL 3M Electronics(1)Amkor Technology(3)Amphenol Communications Solutions(3)Amphenol Corporation(7)Assmann Electronics Inc.(12)ATTEND Technology Inc.(1)Bel Fuse Inc.(1)CUI INC(13)Cystech Electonics Corp.(1)E-SWITCH(39)
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Searched Keyword : 'PLATING' - Total: 836 (11/42) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd. 		0875682294 Datasheet pdf image
285Kb/5P		 2.00mm (.079) Pitch Milli-Grid??Cable-to-Board Receptacle, Dual Row, IDT, Leadfree,22 Circuits, 0.76mm (.030) Gold (Au) Selective Plating
0873681824 Datasheet pdf image
131Kb/3P		 2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Side Entry, 0.38關m (15關) Gold (Au) Plating, 18 Circuits, Leadfree
0873683025 Datasheet pdf image
131Kb/3P		 2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Side Entry, 0.76關m (30關) Gold (Au) Plating, 30 Circuits, Leadfree
0873682425 Datasheet pdf image
131Kb/3P		 2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Side Entry, 0.76關m (30關) Gold (Au) Plating, 24 Circuits, Leadfree
15-97-7022 Datasheet pdf image
53Kb/2P		 Mini-Fit짰 TPA Header, 4.20mm Pitch, Dual Row, Vertical, with PCB Mounting Flange, 2 Circuits, Tin (Sn) Plating, without Drain Holes
15-97-7024 Datasheet pdf image
53Kb/2P		 Mini-Fit짰 TPA Header, 4.20mm Pitch, Dual Row, Vertical, with PCB Mounting Flange, 2 Circuits, Gold (Au) Plating, without Drain Holes
0875683043 Datasheet pdf image
285Kb/5P		 2.00mm (.079) Pitch Milli-Grid??Cable-to-Board Receptacle, Dual Row, IDT, Leadfree 30 Circuits, 0.38mm (.015) Gold (Au) Selective Plating
0875682293 Datasheet pdf image
285Kb/5P		 2.00mm (.079) Pitch Milli-Grid??Cable-to-Board Receptacle, Dual Row, IDT, Leadfree 22 Circuits, 0.38mm (.015) Gold (Au) Selective Plating
0873683024 Datasheet pdf image
131Kb/3P		 2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Side Entry, 0.38關m (15關) Gold (Au) Plating, 30 Circuits, Leadfree
0874272203 Datasheet pdf image
164Kb/4P		 4.20mm (.165) Mini-Fit Jr.??Header, Right Angle, Nylon, without Flange, 22 Circuits, Tin (Sn) over Copper (Cu) Plating, Glow Wire Compatible
0875683463 Datasheet pdf image
285Kb/5P		 2.00mm (.079) Pitch Milli-Grid??Cable-to-Board Receptacle, Dual Row, IDT, Lead-free, 34 Circuits, 0.38mm (.015) Gold (Au) Selective Plating
0757576161 Datasheet pdf image
177Kb/4P		 3.50mm (.138") Pitch, MX150??Header, Breakaway, Vertical, 12 Circuits, 2.5關m (100關") Tin (Sn) Plating, 27.77mm (1.093") Mating Pin Length
0874270642 Datasheet pdf image
240Kb/4P		 4.20mm (.165") Mini-Fit Jr.??Header, Vertical, High Temperature, without Flange, 6 Circuits, Tin (Sn) over Nickel (Ni) Plating, Glow Wire Compatible
0874271802 Datasheet pdf image
257Kb/4P		 4.20mm (.165) Mini-Fit Jr.??Header, Right Angle, Nylon, without Flange,18 Circuits, Tin (Sn) over Nickel (Ni) Plating, Glow Wire Compatible
0875681074 Datasheet pdf image
285Kb/5P		 2.00mm (.079) Pitch Milli-Grid??Cable-to-Board Receptacle, Dual Row, IDT, Lead-free, 10 Circuits, 0.76mm (.030) Gold (Au) Selective Plating
0874270412 Datasheet pdf image
172Kb/4P		 4.20mm (.165") Mini-Fit Jr.??Header, Right Angle, High Temperature, with Flange, 4Circuits, Tin (Sn) over Nickel (Ni) Plating, Glow Wire Compatible
0875682264 Datasheet pdf image
285Kb/5P		 2.00mm (.079) Pitch Milli-Grid??Cable-to-Board Receptacle, Dual Row, IDT, Lead-free, 22 Circuits, 0.76mm (.030) Gold (Au) Selective Plating
0874272402 Datasheet pdf image
257Kb/4P		 4.20mm (.165) Mini-Fit Jr.??Header, Right Angle, Nylon, without Flange,24 Circuits, Tin (Sn) over Nickel (Ni) Plating, Glow Wire Compatible
0875681064 Datasheet pdf image
285Kb/5P		 2.00mm (.079) Pitch Milli-Grid??Cable-to-Board Receptacle, Dual Row, IDT, Lead-free, 10 Circuits, 0.76mm (.030) Gold (Au) Selective Plating
0874270802 Datasheet pdf image
257Kb/4P		 4.20mm (.165") Mini-Fit Jr.??Header, Right Angle, High Temperature, without Flange8 Circuits, Tin (Sn) over Nickel (Ni) Plating, Glow Wire Compatible

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What is PLATING

Electronic component plating plays an important role in the manufacturing process of electronic components.

Plating is used to improve the appearance of electronic components or improve their electronic performance.

For example, plating is used to prevent corrosion and improve durability.

Plating is also used to improve electrical resistance and electrical conductivity.

These platings can be applied to connecting pins, pads, cases, and other parts of electronic components.

The types of plating used in electronic components include gold, silver, nickel, and copper.

Among them, gold plating is the most used and widely used because of its excellent corrosion resistance and electrical performance.

The types and application methods of plating for electronic parts vary depending on the purpose of the part, device composition, and usage environment.

Therefore, during electronic component manufacturing, efforts are made to ensure optimum performance and durability by selecting the appropriate plating method.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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