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PLATING Datasheet, PDF

Searched Keyword : 'PLATING' - Total: 136 (3/7) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
0365000122 Datasheet pdf image
216Kb/4P
2.54mm (.100") Pitch DIN 41612 C Style Female Receptacle, Vertical, Through Hole, 0.60關m (24關") Selective Gold (Au) Plating, 64 Circuits
0365110098 Datasheet pdf image
208Kb/4P
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, 0.60關m (24關") Gold (Au) Plating, Tail Length 2.90mm (.114"), 64 Circuits
0430450818 Datasheet pdf image
187Kb/3P
3.00mm (.118") Pitch Micro-Fit 3.0??Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 8 Circuits, Tin (Sn) Plating, Glow Wire Compatible
0365000123 Datasheet pdf image
216Kb/4P
2.54mm (.100") Pitch DIN 41612 C Style Female Receptacle, Vertical, Through Hole, 0.30關m (12關") Selective Gold (Au) Plating, 64 Circuits
0365000008 Datasheet pdf image
220Kb/4P
2.54mm (.100") Pitch DIN 41612 C Style Female Receptacle, Vertical, Through Hole, 0.60關m (24關") Selective Gold (Au) Plating, 96 Circuits
0365050008 Datasheet pdf image
259Kb/4P
2.54mm (.100") Pitch DIN 41612 B Style Female Receptacle, Vertical, Through Hole, 0.60關m (24關") Selective Gold (Au) Plating, 64 Circuits
15-91-3180 Datasheet pdf image
35Kb/2P
2.54mm Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 18 Circuits, 0.76關m Gold (Au) Selective Plating, without PCB Locator Pegs
15-91-3200 Datasheet pdf image
35Kb/2P
2.54mm Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 20 Circuits, 0.76關m Gold (Au) Selective Plating, without PCB Locator Pegs
0365000032 Datasheet pdf image
217Kb/4P
2.54mm (.100") Pitch DIN 41612 C Style Female Receptacle, Vertical, Through Hole, 0.60關m (24關") Selective Gold (Au) Plating, 96 Circuits
0430450418 Datasheet pdf image
187Kb/3P
3.00mm (.118") Pitch Micro-Fit 3.0??Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 4 Circuits, Tin (Sn) Plating, Glow Wire Compatible
0365000026 Datasheet pdf image
220Kb/4P
2.54mm (.100") Pitch DIN 41612 C Style Female Receptacle, Vertical, Through Hole, 0.60關m (24關") Selective Gold (Au) Plating, 96 Circuits
0365000098 Datasheet pdf image
216Kb/4P
2.54mm (.100") Pitch DIN 41612 C Style Female Receptacle, Vertical, Through Hole, 0.60關m (24關") Selective Gold (Au) Plating, 64 Circuits
0365050003 Datasheet pdf image
261Kb/4P
2.54mm (.100") Pitch DIN 41612 B Style Female Receptacle, Vertical, Through Hole, 0.30關m (12關") Selective Gold (Au) Plating, 64 Circuits
0365000027 Datasheet pdf image
220Kb/4P
2.54mm (.100") Pitch DIN 41612 C Style Female Receptacle, Vertical, Through Hole, 0.30關m (12關") Selective Gold (Au) Plating, 96 Circuits
0365000002 Datasheet pdf image
220Kb/4P
2.54mm (.100") Pitch DIN 41612 C Style Female Receptacle, Vertical, Through Hole, 0.60關m (24關") Selective Gold (Au) Plating, 96 Circuits
0357253910 Datasheet pdf image
131Kb/2P
Quick Disconnect, Female, Piggyback Type, for 14-18 AWG (2.00-0.80mm짼), Metal Strip, Tab 6.35 by 0.81mm (.250 by .032"), Post Tin Plating
15-91-3100 Datasheet pdf image
35Kb/2P
2.54mm Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 10 Circuits, 0.76關m Gold (Au) Selective Plating, without PCB Locator Pegs
15-91-3120 Datasheet pdf image
35Kb/2P
2.54mm Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 12 Circuits, 0.76關m Gold (Au) Selective Plating, without PCB Locator Pegs
0365050289 Datasheet pdf image
162Kb/4P
2.54mm (.100") Pitch DIN 41612 B Style Female Receptacle, Vertical, Through Hole, 0.60關m (24關") Selective Gold (Au) Plating, 64 Circuits
0365110099 Datasheet pdf image
219Kb/4P
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, 0.30關m (12關") Gold (Au) Plating, Tail Length 2.90mm (.114"), 64 Circuits

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What is PLATING


Electronic component plating plays an important role in the manufacturing process of electronic components.

Plating is used to improve the appearance of electronic components or improve their electronic performance.

For example, plating is used to prevent corrosion and improve durability.

Plating is also used to improve electrical resistance and electrical conductivity.

These platings can be applied to connecting pins, pads, cases, and other parts of electronic components.

The types of plating used in electronic components include gold, silver, nickel, and copper.

Among them, gold plating is the most used and widely used because of its excellent corrosion resistance and electrical performance.

The types and application methods of plating for electronic parts vary depending on the purpose of the part, device composition, and usage environment.

Therefore, during electronic component manufacturing, efforts are made to ensure optimum performance and durability by selecting the appropriate plating method.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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