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PLATING Datasheet, PDF

Searched Keyword : 'PLATING' - Total: 1360 (4/68) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
0901210129 Datasheet pdf image
211Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 9 Circuits, Tin (Sn) Plating
0901471120 Datasheet pdf image
181Kb/4P
2.54mm (.100) Pitch C-Grid짰 PC Board Connector, Single Row, Vertical, 20 Circuits, Tin (Sn) Plating
0901210147 Datasheet pdf image
210Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 27 Circuits, Tin (Sn) Plating
0901210123 Datasheet pdf image
211Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 3 Circuits, Tin (Sn) Plating
0901210141 Datasheet pdf image
210Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 21 Circuits, Tin (Sn) Plating
0901471115 Datasheet pdf image
181Kb/4P
2.54mm (.100) Pitch C-Grid짰 PC Board Connector, Single Row, Vertical, 15 Circuits, Tin (Sn) Plating
0901210145 Datasheet pdf image
210Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 25 Circuits, Tin (Sn) Plating
0901210137 Datasheet pdf image
210Kb/3P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 17 Circuits, Tin (Sn) Plating
0901210131 Datasheet pdf image
211Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 11 Circuits, Tin (Sn) Plating
0901210151 Datasheet pdf image
210Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 31 Circuits, Tin (Sn) Plating
0901471216 Datasheet pdf image
181Kb/4P
2.54mm (.100) Pitch C-Grid짰 PC Board Connector, Single Row, Vertical, 16 Circuits, Tin (Sn) Plating
0901210045 Datasheet pdf image
211Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 5 Circuits, Tin (Sn) Plating
0901471215 Datasheet pdf image
181Kb/4P
2.54mm (.100) Pitch C-Grid짰 PC Board Connector, Single Row, Vertical, 15 Circuits, Tin (Sn) Plating
0901210155 Datasheet pdf image
210Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 35 Circuits, Tin (Sn) Plating
0901210156 Datasheet pdf image
210Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 36 Circuits, Tin (Sn) Plating
0901210285 Datasheet pdf image
150Kb/3P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle 5 Circuits, Gold (Au) Plating
0901471220 Datasheet pdf image
181Kb/4P
2.54mm (.100) Pitch C-Grid짰 PC Board Connector, Single Row, Vertical, 20 Circuits, Tin (Sn) Plating
0901210124 Datasheet pdf image
211Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 4 Circuits, Tin (Sn) Plating
0901210133 Datasheet pdf image
211Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 13 Circuits, Tin (Sn) Plating
0901210130 Datasheet pdf image
211Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 10 Circuits, Tin (Sn) Plating

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What is PLATING


Electronic component plating plays an important role in the manufacturing process of electronic components.

Plating is used to improve the appearance of electronic components or improve their electronic performance.

For example, plating is used to prevent corrosion and improve durability.

Plating is also used to improve electrical resistance and electrical conductivity.

These platings can be applied to connecting pins, pads, cases, and other parts of electronic components.

The types of plating used in electronic components include gold, silver, nickel, and copper.

Among them, gold plating is the most used and widely used because of its excellent corrosion resistance and electrical performance.

The types and application methods of plating for electronic parts vary depending on the purpose of the part, device composition, and usage environment.

Therefore, during electronic component manufacturing, efforts are made to ensure optimum performance and durability by selecting the appropriate plating method.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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