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PLATING Datasheet, PDF

Searched Keyword : 'PLATING' - Total: 136 (6/7) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
0428920086 Datasheet pdf image
217Kb/7P
3.96mm (.156") Pitch KK짰 Solid Header, Right Angle, Friction Lock, with Snap-in Plastic Peg PCB Lock, 8 Circuits, 0.38關m (15關") Gold (Au) Selective Plating
15-91-3124 Datasheet pdf image
47Kb/2P
2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 12 Circuits, Tin (Sn) Plating
15-91-3084 Datasheet pdf image
47Kb/2P
2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 8 Circuits, Tin (Sn) Plating
15-91-3214 Datasheet pdf image
40Kb/2P
2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 21 Circuits, Tin (Sn) Plating
15-91-3094 Datasheet pdf image
47Kb/2P
2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 9 Circuits, Tin (Sn) Plating
0365150242 Datasheet pdf image
203Kb/4P
2.54mm (.100") Pitch DIN 41612 R Style Male Header with Wire-Wrap, Vertical, Through Hole Press-Fit, 0.60關m (24關") Selective Gold (Au) Plating, 64 Circuits
0365150489 Datasheet pdf image
176Kb/4P
2.54mm (.100") Pitch DIN 41612 R Style Male Header with Wire-Wrap, Vertical, Through Hole Press-Fit, 0.60關m (24關") Selective Gold (Au) Plating, 64 Circuits
15-91-3114 Datasheet pdf image
47Kb/2P
2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 11 Circuits, Tin (Sn) Plating
15-91-3184 Datasheet pdf image
47Kb/2P
2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 18 Circuits, Tin (Sn) Plating
0365150128 Datasheet pdf image
201Kb/4P
2.54mm (.100") Pitch DIN 41612 R Style Male Header with Wire-Wrap, Vertical, Through Hole Press-Fit, 0.60關m (24關") Selective Gold (Au) Plating, 96 Circuits
15-91-3134 Datasheet pdf image
47Kb/2P
2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 13 Circuits, Tin (Sn) Plating
15-91-3194 Datasheet pdf image
40Kb/2P
2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 19 Circuits, Tin (Sn) Plating
15-91-3224 Datasheet pdf image
47Kb/2P
2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 22 Circuits, Tin (Sn) Plating
0365150002 Datasheet pdf image
211Kb/4P
2.54mm (.100") Pitch DIN 41612 R Style Male Header with Wire-Wrap, Vertical, Through Hole Press-Fit, 0.60關m (24關") Selective Gold (Au) Plating, 96 Circuits
0365150194 Datasheet pdf image
196Kb/4P
2.54mm (.100") Pitch DIN 41612 R Style Male Header with Wire-Wrap, Vertical, Through Hole Press-Fit, 0.60關m (24關") Selective Gold (Au) Plating, 64 Circuits
0365150050 Datasheet pdf image
211Kb/4P
2.54mm (.100") Pitch DIN 41612 R Style Male Header with Wire-Wrap, Vertical, Through Hole Press-Fit, 0.60關m (24關") Selective Gold (Au) Plating, 96 Circuits
15-91-3144 Datasheet pdf image
47Kb/2P
2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 14 Circuits, Tin (Sn) Plating
15-91-3154 Datasheet pdf image
47Kb/2P
2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 15 Circuits, Tin (Sn) Plating
15-91-3204 Datasheet pdf image
47Kb/2P
2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 20 Circuits, Tin (Sn) Plating
0365150146 Datasheet pdf image
198Kb/4P
2.54mm (.100") Pitch DIN 41612 R Style Male Header with Wire-Wrap, Vertical, Through Hole Press-Fit, 0.60關m (24關") Selective Gold (Au) Plating, 64 Circuits

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What is PLATING


Electronic component plating plays an important role in the manufacturing process of electronic components.

Plating is used to improve the appearance of electronic components or improve their electronic performance.

For example, plating is used to prevent corrosion and improve durability.

Plating is also used to improve electrical resistance and electrical conductivity.

These platings can be applied to connecting pins, pads, cases, and other parts of electronic components.

The types of plating used in electronic components include gold, silver, nickel, and copper.

Among them, gold plating is the most used and widely used because of its excellent corrosion resistance and electrical performance.

The types and application methods of plating for electronic parts vary depending on the purpose of the part, device composition, and usage environment.

Therefore, during electronic component manufacturing, efforts are made to ensure optimum performance and durability by selecting the appropriate plating method.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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