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PLATING Datasheet, PDF

Search Description : 'PLATING' - Total: 15089 (8/755) Pages
Electronic ManufacturerPart NumberDatasheetElectronics Description

Molex Electronics Ltd.
0705430001 2.54mm Pitch SL™ Header, Single Row, Vertical, Pocket, Shrouded, 2Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0363 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0015477630 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-91-3033 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 3 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0472669101 0.50mm Pitch HDMI* Receptacle, Right Angle, Black, Through Hole Shell Tab Length 1.90mm 0.76μm Gold (Au) Contact Plating, Gold (Au) Flash Solder Tail Plating
0702461202 2.54mm Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 12Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0010897322 2.54mm Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 32 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm PC Tail
15-80-0663 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0010897542 2.54mm Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 54 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm PC Tail
15-80-0465 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430117 2.54mm Pitch SL™ Header, Single Row, Vertical, Pocket, Shrouded, 13Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0010897540 2.54mm Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 54 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm PC Tail
0015477764 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 64 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0705 null2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0565 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702461002 2.54mm Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430113 2.54mm Pitch SL™ Header, Single Row, Vertical, Pocket, Shrouded, 9Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-91-3253 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 25 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-1101 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15-91-2085 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 8 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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