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PLATING Datasheet, PDF

Searched Keyword : 'PLATING' - Total: 320 (9/16) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
0527461371 Datasheet pdf image
540Kb/7P
0.50mm (.020") Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom Contact Style, 13 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging
0545482671 Datasheet pdf image
541Kb/7P
0.50mm (.020") Pitch FFC/FPC Connector, 1.20mm (.047") Height, Right Angle, SMT ZIF, Bottom Contact Style, 26 Circuits, Lead-free, Gold (Au) Plating
0538660870 Datasheet pdf image
147Kb/4P
1.60mm (.063") Pitch Board-to-Board Panel Detachable PCB Header, Surface Mount, 8Circuits, Gold (Au) Selective Plating, Tape-and-Reel Packaging, Lead-free
0522071160 Datasheet pdf image
532Kb/9P
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Right Angle, ZIF, Top Contact StyleReceptacle, 11 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging
0545481671 Datasheet pdf image
541Kb/7P
0.50mm (.020") Pitch FFC/FPC Connector, 1.20mm (.047") Height, Right Angle, SMT, ZIF, Bottom Contact Style, 16 Circuits, Lead-free, Gold (Au)Plating
0522070660 Datasheet pdf image
532Kb/9P
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Right Angle, ZIF, Top Contact StyleReceptacle, 6 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging
0527451797 Datasheet pdf image
491Kb/7P
0.50mm (.020") Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Top Contact Style17 Circuits, Lead-free, Gold (Au) Contact Plating, High Barrier Packaging
0545481071 Datasheet pdf image
541Kb/7P
0.50mm (.020") Pitch FFC/FPC Connector, 1.20mm (.047") Height, Right Angle, SMT,ZIF, Bottom Contact Style, 10 Circuits, Lead-free, Gold Contact Plating
15-91-3280 Datasheet pdf image
35Kb/2P
2.54mm Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 28 Circuits, 0.76關m Gold (Au) Selective Plating, without PCB Locator Pegs
15-91-3300 Datasheet pdf image
35Kb/2P
2.54mm Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 30 Circuits, 0.76關m Gold (Au) Selective Plating, without PCB Locator Pegs
0528304442 Datasheet pdf image
125Kb/3P
Modular Jack, Right Angle, 4/4 Circuits, 1.3關m (50關") Gold (Au) Selective Plating, withBeveled Metal Pins, Tray Packaging, Lead-free
0527451497 Datasheet pdf image
491Kb/7P
0.50mm (.020") Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Top Contact Style14 Circuits, Lead-free, Gold (Au) Contact Plating, High Barrier Packaging
0545502471 Datasheet pdf image
519Kb/6P
0.50mm (.020") Pitch FFC/FPC Connector, 1.20mm (.047") Height, Right Angle, SMT,ZIF, Top Contact Style, 24 Circuits, Lead-free, Gold Contact Plating
0522070560 Datasheet pdf image
532Kb/9P
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Right Angle, ZIF, Top Contact StyleReceptacle, 5 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging
15-91-3060 Datasheet pdf image
35Kb/2P
2.54mm Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 6 Circuits, 0.76關m Gold (Au) Selective Plating, without PCB Locator Pegs
0527450797 Datasheet pdf image
491Kb/7P
0.50mm (.020") Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Top Contact Style7 Circuits, Lead-free, Gold (Au) Contact Plating, High Barrier Packaging
0527451597 Datasheet pdf image
491Kb/7P
0.50mm (.020") Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Top Contact Style,15 Circuits, Lead-free, Gold (Au) Contact Plating, High Barrier Packaging
0512811094 Datasheet pdf image
445Kb/8P
0.50mm (.020") Pitch FFC/FPC Connector, SMT, Right Angle, Non-ZIF, Dual ContactStyle, 1.20mm (.047") Mated Height, 10 Circuits, Lead-free, Gold (Au) Plating
0527451997 Datasheet pdf image
491Kb/7P
0.50mm (.020") Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Top Contact Style,19 Circuits, Lead-free, Gold (Au) Contact Plating, High Barrier Packaging
0670688100 Datasheet pdf image
275Kb/6P
Universal Serial Bus (USB), Shielded I/O, Type B Receptacle, Right Angle with KinkedPins, Color Black, Gold (Au) Flash Plating, Tube Pack, Lead Free

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What is PLATING


Electronic component plating plays an important role in the manufacturing process of electronic components.

Plating is used to improve the appearance of electronic components or improve their electronic performance.

For example, plating is used to prevent corrosion and improve durability.

Plating is also used to improve electrical resistance and electrical conductivity.

These platings can be applied to connecting pins, pads, cases, and other parts of electronic components.

The types of plating used in electronic components include gold, silver, nickel, and copper.

Among them, gold plating is the most used and widely used because of its excellent corrosion resistance and electrical performance.

The types and application methods of plating for electronic parts vary depending on the purpose of the part, device composition, and usage environment.

Therefore, during electronic component manufacturing, efforts are made to ensure optimum performance and durability by selecting the appropriate plating method.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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