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PLATING Datasheet, PDF

Search Description : 'PLATING' - Total: 15089 (1/755) Pages
Electronic ManufacturerPart NumberDatasheetElectronics Description

Molex Electronics Ltd.
15-80-0705 null2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0383 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430020 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .120" Pocket, Shrouded, 21Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-91-2065 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 6 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-91-3253 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 25 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702464002 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 40 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-1121 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15-91-2095 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 9 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0474081001 0.50mm (.020") Pitch HDMI* Receptacle, Right Angle, Reverse, without Dimple, with Mylar, 0.76μm (30μ") Gold (Au) Plating, Matte Tin Plating on Shell, 19 Circuits, Lead free
0705630129 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .180" Pocket, Shrouded, 25Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705450078 2.54mm (.100") Pitch SL™ Header, Single Row .120" Pocket Vertical, Shrouded, with Press-fir Plastic Peg, 9 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-1401 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
0705430023 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .120" Pocket, Shrouded, 24Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-91-3133 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 13 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

Japan Aviation Electron...
DD1B030VA1 NIOKEL PLATING THROUGH HOLE AREA TIN PLATING

Molex Electronics Ltd.
0010897180 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 18 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail
15-80-0243 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0409 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.38μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15-80-0303 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430115 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .120" Pocket, Shrouded, 11Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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