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PLATING Datasheet, PDF

Search Description : 'PLATING' - Total: 15089 (1/755) Pages
Electronic ManufacturerPart NumberDatasheetElectronics Description

Molex Electronics Ltd.
15-91-3193 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 19 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
10-89-7140 2.54mm Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 14 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm PC Tail
15-80-0605 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0303 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0010897722 2.54mm Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 72 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm PC Tail
0702463001 2.54mm Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0563 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630123 2.54mm Pitch SL™ Header, Single Row, Vertical, Pocket, Shrouded, 19Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-1521 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.76μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15-80-0229 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
0702800459 2.54mm Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 82 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm PC Tail
15-80-0289 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15-91-2095 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 9 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0543 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 54 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0015477672 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 72 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

Amphenol Corporation
28100 BODY - BRASS, NICKEL PLATING CONTACT - BRASS, SILVER PLATING

Molex Electronics Ltd.
0705630015 2.54mm Pitch SL™ Header, Single Row, Vertical, Pocket, Shrouded, 16 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0010897400 2.54mm Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 40 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm PC Tail
0705550050 2.54mm Pitch SL™ Header, Single Row, Right Angle, Pocket, Shrouded,with Press-fit Plastic Peg, 16 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430122 2.54mm Pitch SL™ Header, Single Row, Vertical, Pocket, Shrouded, 18 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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