PRE-MARKED Datasheet(PDF) - BFP843 - Infineon Technologies AG

Manufacturer	Part #	Datasheet	Description
Infineon Technologies A...	BFP843	1Mb/26P	Robust Low Noise Broadband Pre-Matched Bipolar RF Transistor Revision 1.0, 2013-06-19
	BFR843EL3	1Mb/27P	Robust Low Noise Broadband Pre-Matched Bipolar RF Transistor Revision 1.0, 2014-08-05
	BFP843F	1Mb/26P	Robust Low Noise Broadband Pre-Matched Bipolar RF Transistor Revision 1.0, 2013-06-19
	DDB6U50N22W1RP_B11	460Kb/15P	EasyBRIDGE module with chopper configuration and PressFIT / pre-applied thermal interface material Revision 1.00 2022-09-05
	DDB6U50N16W1RP	477Kb/15P	Preliminary datasheet EasyBRIDGE module with chopper configuration and pre-applied Thermal Interface Material 0.10 2021-07-28
	DDB6U50N16W1RP_B11	500Kb/14P	Preliminary datasheet EasyBRIDGE module with chopper configuration and PressFIT / pre-applied Thermal Interface Material 0.10 2021-08-27
	FF4MR20KM1HP	722Kb/15P	62 mm C-Series module with CoolSiC™ Trench MOSFET and pre-applied thermal interface material Revision 1.00 2023-05-05
	FF2MR12KM1HP	734Kb/16P	62 mm C-Series module with CoolSiC™ Trench MOSFET and pre-applied thermal interface material Revision 0.20 2023-03-03
	FF1MR12KM1HP	732Kb/16P	62 mm C-Series module with CoolSiC™ Trench MOSFET and pre-applied thermal interface material Revision 0.30 2023-02-27
	FF3MR20KM1HP	715Kb/15P	62 mm C-Series module with CoolSiC™ Trench MOSFET and pre-applied thermal interface material Revision 1.00 2023-05-05
	FF6MR12KM1HP	721Kb/16P	62 mm C-Series module with CoolSiC™ Trench MOSFET and pre-applied thermal interface material Revision 0.10 2023-03-16
	FP15R12W1T7P	969Kb/19P	EasyPIM??module with TRENCHSTOP?줚GBT7 and Emitter Controlled 7 diode and NTC / pre-applied Thermal Interface Material Datasheet 0.10 2021-03-18
	FF200R12KS4P	504Kb/9P	62mm C-Series module with the fast IGBT2 for high-frequency switching and pre-applied Thermal Interface Material V 3.0 2020-02-17
	FP35R12KT4P	714Kb/12P	EconoPIM™2 module with Trench/Fieldstop IGBT4 and Emitter Controlled diode and pre-applied Thermal Interface Material V 3.0 2017-03-17
	FF400R12KT4P	599Kb/9P	62mm C-Series module with fast Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and pre-applied Thermal Interface Material V 3.0 2017-06-20
	FP50R12KT4P	714Kb/12P	EconoPIM™2 module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and NTC / pre-applied Thermal Interface Material V 3.0 2017-03-17
	FP35R12W2T4P	799Kb/12P	EasyPIM™ module with fast Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and NTC / pre-applied Thermal Interface Material V 3.0 2017-05-03
	FP50R12N2T7P	606Kb/20P	EconoPIM™2 module with TRENCHSTOP™IGBT7 and emitter controlled 7 diode and NTC / pre-applied thermal interface material Revision 1.00 2022-02-01
	FF2400RB12IP7P	723Kb/15P	PrimePACK™3+ B-series module with TRENCHSTOP™IGBT7 and emitter controlled 7 diode and NTC / pre-applied thermal interface material Revision 1.10 2022-03-17
	FF1800R23IE7P	707Kb/20P	PrimePACK™3+ B-series module with TRENCHSTOP™IGBT7 and emitter controlled 7 diode and NTC / pre-applied thermal interface material Revision 1.00 2022-05-03

PRE-MARKED Datasheet, PDF

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