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PRESSFIT Datasheet, PDF

Search Description : 'PRESSFIT' - Total: 247 (1/13) Pages
Electronic ManufacturerPart NumberDatasheetElectronics Description

First Components Intern...
PIFR3501P 35Amp Insulate Flag Pressfit 35Amp Insulate Flag Pressfit High Current Capability

Molex Electronics Ltd.
0743011200 2.00mm Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Extended PC Tail, Open End Option, 144 Circuits

Infineon Technologies A...
FS50R12W2T4_B11 EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC

FCI connector
PBFR5023-43 50Amp Bosch Type Pressfit AVALANCHE Automotive Rectifiers

Vishay Siliconix
VS-ENQ030L120S EMIPAK-1B PressFit Power Module Neutral Point Clamp Topology, 30 A

Molex Electronics Ltd.
0430450623_18 Micro-Fit 3.0 Right Angle Header, 3.00mm Pitch, Dual Row, 6 Circuits, with PCB Pressfit
0736442207 2.00mm Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location D, Polarizing Key Position A, 72 Circuits

Infineon Technologies A...
F3L200R07PE4 EasyPACK4 module with Trench/Fieldstopp IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC
FP15R06W1E3_B11 EasyPIM module with Trench/Fieldstopp IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC

First Components Intern...
PFFR2501 25.0 AMPS AUTOMOTIVE 1/2 FLAG LEAD PRESSFIT DIODE
PLFR3501 35.0 Amp LUCAS AUTO PRESSFIT

Molex Electronics Ltd.
0736443000 2.00mm Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 144 Circuits
0736442109 2.00mm Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position E, 72 Circuits

Infineon Technologies A...
FS150R12PT4 EconoPACK™4 Modul mit schnellem Trench/Feldstopp IGBT4 und Emitter Controlled 4 Diode und PressFIT / NTC
TDB6HK360N16P EconoPACK4 module and PressFIT / NTC
DDB6U104N16RRP-B37 EconoPACK™2 Modul mit Trench/Feldstopp IGBT4 und Emitter Controlled 4 Diode und PressFIT
FS450R17OE4P EconoPACK™+ Modul mit Trench/Feldstopp IGBT4 und Emitter Controlled 3 Diode und PressFIT / bereits aufgetragenem Thermal Interface Material

Molex Electronics Ltd.
0736440217 2.00mm Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits
0743014104 2.00mm Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Extended PC Tail, Polar/Guide Option, 72 Circuits

Infineon Technologies A...
FF225R17ME4_B11 EconoDUAL3 module with trench/fieldstop IGBT4 and Emitter Controlled diode and PressFIT / NTC

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