SMT Datasheet(PDF) - AT-2200 - Hirose Electric

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SMT Datasheet, PDF

Searched Keyword : 'SMT' - Total: 21 (1/2) Pages

Manufacturer	Part #	Datasheet	Description
Hirose Electric	AT-2200	178Kb/3P	SMT Stripline Mounting Fixed Attenuators
	DF12A-20DS-0.5V	255Kb/6P	0.5mm Pitch SMT Board to Board Connector
	3260-8S1	145Kb/4P	3200 SERIES SMT CONNECTORS FOR MICROMINIATURE INTERFACES
	DF151.830DS-0.65V56	278Kb/10P	0.65mm Pitch SMT Board to Board Connector
	DF12A3.0-30DS-0.5V81	227Kb/11P	0.5mm Pitch SMT Board to Board Connector
	MRF03	264Kb/5P	SMT Low-Profile Coaxial Multiple Contact Connectors
	DF15A-20DS-0.65V	362Kb/6P	0.65mm Pitch SMT Board to Board Connector
	DF12E3.0-20DP-0.5V81	227Kb/11P	0.5mm Pitch SMT Board to Board Connector
	DF123.0-50DP-0.5V86	227Kb/11P	0.5mm Pitch SMT Board to Board Connector
	DF12B3.5-40DP-0.5V86	264Kb/12P	0.5mm Pitch SMT Board to Board Connector
	DF16-14DS-0.5V	236Kb/6P	0.5mm Pitch SMT Board to Board Connector
	N-FL	227Kb/6P	Lightweight SMT Miniature Coaxial Connectors ??1.4 mm Mated Height
	H.FL75	437Kb/6P	75 廓 Small Coaxial Connectors (SMT Low Profi le)
	N.FL	265Kb/6P	Lightweight SMT Miniature Coaxial Connectors ??1.4 mm Mated Height
	IC11S-68PL-1.27SF-EJR	1Mb/10P	Single Slot SMT Connectors For Card-Bus Based PC Cards
	U.FL-R-SMT	177Kb/8P	Ultra Small SMT Coaxial Connectors - Low Profile 1.9mm or 2.4mm Mated Height
	UX60S	251Kb/7P	Mini-B Connectors, SMT mount receptacles meeting requirements of USB 2.0 Standard
	X.FL	965Kb/8P	Low-Profile, Ultraminiature Lightweight SMT Coaxial Connectors - 0.94 or 1.2 mm Mated Height
	DF9	193Kb/7P	1mm Pitch SMT Board-to-Board Connectors(Standard Interface Connector Compliant with VESA FPDI-1)
	DF9-9S-1V	275Kb/8P	1mm Pitch SMT Board to Board Connector(Standard Interface Connector Compliant with VESA FPDI-1)

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What is SMT

SMT stands for Surface Mount Technology, and refers to a technology for attaching electronic components to a circuit board (PCB).

SMT has the advantage of increasing space efficiency and automation process productivity compared to the existing Through-Hole Technology (THT).

SMT attaches electronic components attached to the surface of the PCB through a reflow soldering process.

In this process, electronic components are miniaturized into tiny insulators or packages. In the SMT process, tiny solder pads are first attached to the surface to attach these miniaturized components to the surface of the PCB.

Then, electronic components are attached on top of it, and the entire PCB is heated with a heater to melt and attach the solder.

The SMT process has the advantage of increasing the space efficiency of the PCB by reducing the size of electronic components attached to the PCB.

In addition, productivity can be increased with automated production processes.

Therefore, most of the current electronic components are produced by SMT technology.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.

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