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SMT Datasheet, PDF

Searched Keyword : 'SMT' - Total: 14 (1/1) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
0891990019 Datasheet pdf image
98Kb/2P
1.27mm Pitch PC Card I/O Receptacle - SMT
0879660002 Datasheet pdf image
399Kb/7P
1.00mm (.039) Pitch DDR2 DIMM Socket, SMT, 0.76關m (30關) Gold (Au), 240 Circuit, Lead free
0879335031 Datasheet pdf image
174Kb/4P
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120)
0879331215 Datasheet pdf image
355Kb/7P
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.05關m (2關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap
0879333015 Datasheet pdf image
355Kb/7P
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 30 Circuits, 0.05關m (2關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap
0879331211 Datasheet pdf image
355Kb/7P
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.38關m (15關) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap
0879331007 Datasheet pdf image
355Kb/7P
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 10 Circuits, 0.05關m (2關) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap
0879331217 Datasheet pdf image
355Kb/7P
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.76關m (30關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap
0877823009 Datasheet pdf image
560Kb/8P
0.60mm (.024) Pitch miniDIMM DDR3 Socket, Vertical, SMT, 0.76關m (30關) Gold (Au) over Nickel, 1.5V, with Pick and Place Cover, 244 Circuits, Type D Tray, Lead free
0877822007 Datasheet pdf image
560Kb/8P
0.60mm (.024) Pitch miniDIMM DDR2 Socket, Vertical, SMT, 0.76關m (30關) Gold (Au) over Nickel, 1.8V, with Pick and Place Cover, 244 Circuits, Type C Tray, Lead free
0877823007 Datasheet pdf image
560Kb/8P
0.60mm (.024) Pitch miniDIMM DDR3 Socket, Vertical, SMT, 0.76關m (30關) Gold (Au) over Nickel, 1.5V, with Pick and Place Cover, 244 Circuits, Type C Tray, Lead free
0877822009 Datasheet pdf image
560Kb/8P
0.60mm (.024) Pitch miniDIMM DDR2 Socket, Vertical, SMT, 0.76關m (30關) Gold (Au) over Nickel, 1.8V, with Pick and Place Cover, 244 Circuits, Type D Tray, Lead free
0877822005 Datasheet pdf image
560Kb/8P
0.60mm (.024) Pitch miniDIMM DDR2 Socket, Vertical, SMT, 0.76關m (30關) Gold (Au) over Nickel, 1.8V, with Pick and Place Cover, 244 Circuits, Type A Tray, Lead free
0877823005 Datasheet pdf image
560Kb/8P
0.60mm (.024) Pitch miniDIMM DDR3 Socket, Vertical, SMT, 0.76關m (30關) Gold (Au) over Nickel, 1.5V, with Pick and Place Cover, 244 Circuits, Type A Tray, Lead free

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What is SMT


SMT stands for Surface Mount Technology, and refers to a technology for attaching electronic components to a circuit board (PCB).

SMT has the advantage of increasing space efficiency and automation process productivity compared to the existing Through-Hole Technology (THT).

SMT attaches electronic components attached to the surface of the PCB through a reflow soldering process.

In this process, electronic components are miniaturized into tiny insulators or packages. In the SMT process, tiny solder pads are first attached to the surface to attach these miniaturized components to the surface of the PCB.

Then, electronic components are attached on top of it, and the entire PCB is heated with a heater to melt and attach the solder.

The SMT process has the advantage of increasing the space efficiency of the PCB by reducing the size of electronic components attached to the PCB.

In addition, productivity can be increased with automated production processes.

Therefore, most of the current electronic components are produced by SMT technology.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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