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START-UP Datasheet, PDF

KEC(Korea Electronics)(3)Kemet Corporation(67)Keysight Technologies(3)Kinetic Technologies.(9)Kingbor Technology Co(3)KISTLER INSTRUMENT CORPORATION(9)KOA Speer Electronics, Inc.(2)KODENSHI_AUK CORP.(10)Kyocera Kinseki Corpotation(2)Laird Tech Smart Technology(4)Lanner All Rights Reserved.(3)Leadtrend Technology(8)Ledil, Inc.(3)LEDTRONICS, INC(1)LEM(4)Leshan Radio Company(6)Level One(11)Lineage Power Corporation(1)Linear Dimensions Semiconductor(2)Linear Integrated Systems(8)Linear Technology(207)List of Unclassifed Manufacturers(44)List of Unclassifed Manufacturers(80)Lite-On Technology Corporation(1)Littelfuse(31)Lowpower Semiconductor inc(13)LSI Computer Systems(10)Lumics GmbH(30)Lumileds Lighting Company(1)Luminus, Inc(3)M.S. Kennedy Corporation(2)M/A-COM Technology Solutions, Inc.(68)Macronix International(2)Major-Power Technology Co., LTD.(2)Mallory performance club(2)Mallory Sonalert Products Inc(3)Marktech Corporate(7)Maxim Integrated Products(256)Mean Well Enterprises Co., Ltd.(12)Mechatronics, Inc.(1)Meder Electronic(1)Melexis Microelectronic Systems(1)MERITEK ELECTRONICS CORPORATION(1)METZ CONNECT GmbH(6)Micon Design Technology Corporation(7)MICORO CRYSTAL SWITZERLAND(9)Micrel Semiconductor(15)Micro Analog systems(2)Micro Commercial Components(2)Micro Electronics(3)Micro Linear Corporation(1)Microchip Technology(50)Microsemi Corporation(13)Mimix Broadband(9)Mini-Circuits(21)Minilogic Device Corporation Limited(3)Mitsubishi Electric Semiconductor(3)Mitsumi Electronics, Corp.(12)MKS Instruments.(5)MMD Components(3)Molex Electronics Ltd.(24)Molex Electronics Ltd.(14)Molex Electronics Ltd.(28)Molex Electronics Ltd.(8)Molex Electronics Ltd.(1)Molex Electronics Ltd.(23)Monolithic Power Systems(91)MOSDESIGN SEMICONDUCTOR CORP(1)Motorola, Inc(12)Moxa Inc.(1)MPS Industries, Inc.(1)Murata Manufacturing Co., Ltd(106)Murata Manufacturing Co., Ltd.(3)National Instruments Corporation(14)National Semiconductor (TI)(89)NEC(16)Nel Frequency Controls,inc(1)Nell Semiconductor Co., Ltd(27)Neutrik AG(3)New Japan Radio(12)New Jersey Semi-Conductor Products, Inc.(4)Nexperia B.V. All rights reserved(6)NEXTCHIP Co,Ltd(1)NIC-Components Corp.(20)NimbeLink Corp.(4)Nippon Precision Circuits Inc(1)Nisshinbo Micro Devices Inc.(4)Nordic Semiconductor(1)Norgren Ltd(2)NTE Electronics(4)Nuvotem Talema(1)NXP Semiconductors(61)NXP Semiconductors(152)Ohmite Mfg. Co.(3)Omega Engineering, Inc.(7)Omron Electronics LLC(14)ON Semiconductor(94)OptoSupply International(1)Orister Corporation(2)OSRAM GmbH(6)
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Searched Keyword : 'START-UP' - Total: 14 (1/1) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
0988971119 Datasheet pdf image
62Kb/1P
NSCC Receptacle Terminal Size 1.5, Wire Size 0.49 up to 0.94mm2
0988971109 Datasheet pdf image
62Kb/1P
NSCC Receptacle Terminal Size 1.5, Wire Size 0.22 up to 0.44mm2
0988971129 Datasheet pdf image
62Kb/1P
NSCC Receptacle Terminal Size 1.5, Wire Size 0.95 up to 1.87mm2
1700712013 Datasheet pdf image
41Kb/2P
zSFP+ Stacked Ganged Assembly with Elastomeric Gasket, 2-by-2 with Outer Down/Up
1700716013 Datasheet pdf image
41Kb/2P
zSFP+ Stacked Ganged Assembly with Elastomeric Gasket, 2-by-6 with Outer Down/up
1700711013 Datasheet pdf image
41Kb/2P
zSFP+ Stacked Ganged Assembly with Elastomeric Gasket, 2-by-1 with Outer Down/up
1700714013 Datasheet pdf image
41Kb/2P
zSFP+ Stacked Ganged Assembly with Elastomeric Gasket, 2-by-4 with Outer Down/up
1712242013 Datasheet pdf image
42Kb/2P
zSFP+ Stacked Ganged Assembly with Metal Spring Fingers, 2-by-2 with Outer Down/Up
1712244013 Datasheet pdf image
42Kb/2P
zSFP+ Stacked Ganged Assembly with Metal Spring Fingers, 2-by-4 with Outer Down/up
1712246013 Datasheet pdf image
42Kb/2P
zSFP+ Stacked Ganged Assembly with Metal Spring Fingers, 2-by-6 with Outer Down/Up Light Pipes
1712248013 Datasheet pdf image
42Kb/2P
zSFP+ Stacked Ganged Assembly with Metal Spring Fingers, 2-by-8 with Outer Down/Up Light Pipes
0740411001 Datasheet pdf image
36Kb/2P
VHDM Optimized for single-ended and differential backplane applications delivering data rates up to 3.125 Gbps. Modular construction enables design flexibility. Wafer receptacle, Right-Angle, 8-Row (Series: 74040, 74686, 75299 and 75192)
0751661100 Datasheet pdf image
34Kb/2P
VHDM RAM Optimized for single-ended and differential backplane applications delivering data rates up to 3.125 Gbps. Modular construction enables design flexibility. Wafer receptacle, Right-Angle, 8-Row, Lead-free (Series:75165 and 75346)
0746023030 Datasheet pdf image
33Kb/2P
VHDM RAM Optimized for single-ended and differential backplane applications delivering data rates up to 3.125 Gbps. Modular construction enables design flexibility. Wafer receptacle, Right-Angle, 6-Rows, Lead-free (Series: 74600 and 75286)

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